Production Process of AlN Ceramic Substrates

Aluminum nitride (AlN) ceramics exhibit excellent overall properties and have become a widely researched next-generation advanced ceramic material in recent years. It possesses high thermal conductivity, low dielectric constant, low dielectric loss, excellent electrical insulation, a thermal expansion coefficient compatible with silicon, and non-toxicity, making it an ideal material for high-density, high-power, and high-speed integrated circuit substrates and packaging.

 

Although hot pressing and isostatic pressing are suitable for producing high-performance AlN ceramics, these methods are costly and have low production efficiency, which cannot meet the increasing demand for AlN ceramic substrates in the electronics industry. To solve this problem, many manufacturers have adopted the tap casting process to make AlN ceramic substrates in recent years. Tap casting has thus become the main forming process for AlN ceramic substrates used in the electronics industry.

 

Flow chart of tap casting method for making AlN substrate

 

1. Ball Milling and Slurry Preparation

In the preparation of AlN slurry, organic solvents such as dispersants, binders, and plasticizers are typically added to achieve the desired rheological properties for easy casting. Additionally, Y₂O₃ is often added as a sintering aid to promote sintering under normal atmospheric pressure. The viscosity of the slurry has a significant impact on the performance of the substrate. Factors influencing the viscosity include milling time, the amount of organic solvents, dispersants, binders, and plasticizers. Therefore, the choice of slurry formulation and process control has a substantial effect on the performance of the ceramic substrate.

 

2. Tap Casting 

Tap casting forming is a high-efficiency process that facilitates continuous and automated production, reducing costs and enabling mass production. The thickness of the produced substrate can range from less than 10 μm to over 1 mm. Tap casting is a critical step in the practical application of AlN ceramic substrates and holds great potential for future applications. Compared to other forming methods, Tap casting has several advantages:

  1. Simple equipment and process, enabling continuous production.
  2. Capable of producing single-phase or multi-phase ceramic thin films.
  3. Minimal defects, uniform performance, high production efficiency, and continuous operation.
  4. Suitable for both large and small batch production, making it ideal for industrial manufacturing.
  5. Particularly suitable for the preparation of large, thin ceramic components, which is a feature difficult to achieve with pressing or extrusion techniques.

3. Degassing

The green body of the substrate produced by tap casting contains a large amount of organic materials, resulting in a high porosity and low strength. If sintered directly, it may lead to excessive shrinkage, warping of the substrate, and adhesion between green bodies during sintering, which affects the yield and thermal conductivity. To prevent these defects, the green body is pre-fired in a nitrogen atmosphere furnace at 1100°C before sintering. This helps improve the strength of the green body, reduce porosity, and obtain AlN substrates with high flatness and good performance.

 

AlN substrate

 

4. Sintering

After degassing, the AlN substrates undergo high-temperature sintering. The sintering process for high thermal conductivity AlN substrates focuses on sintering methods, the addition of sintering aids, and the control of the sintering atmosphere.

Since AlN is a covalent compound with a small self-diffusion coefficient, densification during sintering is very difficult. Rare-earth metal oxides and alkaline earth metal oxides are typically used as sintering aids to promote sintering, though temperatures above 1800°C are usually required. There are three primary ways to achieve dense and high-performance AlN ceramics:

  1. Use of ultra-fine powders;
  2. Hot pressing or isostatic pressing;
  3. Introduction of sintering aids.

The five main sintering techniques for AlN substrates include hot-press sintering, pressureless sintering, microwave sintering, spark plasma sintering (SPS), and self-propagating high-temperature synthesis (SHS). Among these, hot-press sintering is currently the primary method for producing high thermal conductivity, dense AlN ceramics.

 

Xiamen Juci's AlN powder has the characteristics of high purity,low oxygen content,high sintering activity,and sharp size distribution. and it is widely used for tap casting AlN substrate.

Eco-Friendly Innovation Formaldehyde-Free Mineral Fiber Binders

In the domain of mineral fiber applications, the advent of formaldehyde-free insulation binders represents a pivotal shift. Traditional binders, such as phenolic resins used in glass wool products, while offering strength and performance benefits, unfortunately, contain harmful substances like free formaldehyde, urea, and phenol. The perils of formaldehyde are extensive, from respiratory damage and allergy exacerbation to increased cancer risks and a plethora of associated symptoms. Its volatility commences at 19°C, with a persistent 3 - 15-year evaporation cycle, lurking within various materials and posing long-term health hazards.

Enter LINTEC's waterborne formaldehyde-free insulation binders, spearheading a revolutionary change. These binders, part of the advanced ECOSET series, are aqueous-based and environmentally benign, completely devoid of formaldehyde and VOCs. They exhibit remarkable properties, including superior bonding strength, scratch resistance, chemical resistance, and stain resistance. Even under the rigors of 200°C curing, they maintain their integrity, ensuring high bonding efficacy and fiber yield across diverse glass wool densities. Notably, models like ECOSET 2020 offer additional advantages such as anti-precuring capabilities and color preservation.
 
Formaldehyde-Free Insulation Binder

Moreover, LINTEC's glass fiber filter paper binders, also formaldehyde-free and VOC-free, are water-soluble heat-curable resins. Upon curing, they possess outstanding hardness, stiffness, and adhesion to a multitude of materials. Their zero formaldehyde and VOC content precisely meets the market's burgeoning demand for pure, odorless, and sustainable products. This paradigm shift not only safeguards human health but also ushers in a new era of green manufacturing within the industry, heralding a future where eco-friendly binders redefine the standards of quality and sustainability.

Exploring the Advantages of PVA Film

PVA film, also known as polyvinyl alcohol film, is a remarkable polymer-based packaging material that offers a multitude of advantages for various industries.PVA film is non-toxic and safe for direct contact with food and pharmaceutical products. It meets regulatory standards for food contact materials and does not compromise the quality or safety of the packaged items. PVA film is also used in specialized industrial applications, such as the packaging of adhesives, dyes, and chemicals, thanks to its excellent moisture resistance and barrier properties.

 

One of the notable variants of PVA film is the PVA water-soluble film. This film is specially designed to dissolve quickly and completely in water, making it an ideal choice for single-use packaging applications. The PVA water-soluble film provides exceptional convenience and eco-friendliness, especially in industries such as food packaging, detergent packaging, and agricultural applications.

 

In contrast to the water-soluble grade, PVA insoluble film offers excellent resistance to moisture and provides a robust barrier to protect the packaged contents. This type of film is commonly utilized in applications where moisture resistance is critical, such as electronic components packaging, chemical packaging, and industrial materials packaging.

 

PVA special film refers to the customized versions of PVA film that are tailored to meet specific requirements of different industries. These films may possess additional functionalities, such as enhanced strength, increased clarity, improved tear resistance, or specific barrier properties. PVA special films find applications in diverse sectors like pharmaceutical packaging, cosmetic packaging, and Marble demoulding industrial applications.

 

PVA film can be manufactured in different thicknesses and sizes to suit various packaging needs. Its compatibility with different substances allows it to be used with a wide range of products, including powders, liquids, and solid items. ElephChem can customize PVA film of various sizes and specifications according to customer requirements, suitable for a variety of products.

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The potential of PVA in diverse industries

Polyvinyl alcohol, commonly known as PVA, is a versatile polymer that has found its way into numerous industries due to its exceptional properties and wide range of applications.

 

Polyvinyl Alcoho is a water-soluble synthetic polymer that finds application in diverse industries. It is commonly used as a binder in the production of paper, textiles, and nonwoven fabrics. PVA imparts desirable characteristics to these materials, including improved strength, tear resistance, and printability. Additionally, it acts as a key ingredient in personal care products, such as shampoos, hair gels, and face masks, providing viscosity and film-forming properties.

 

PVA Powder, also referred to as PVA Granules, is a finely powdered form of polyvinyl alcohol.When PVA products are produced, they are in the form of flakes and floc. In order to facilitate transportation and later dissolution, PVA flakes need to be ground into particles or powders of different sizes. It should be noted that the smaller the particles, the better. Specific methods must be used during the dissolution process of particles or powders that are too small to prevent the powder from agglomerating when exposed to water. For specific methods, please refer to "How to make PVA dissolve faster"

 

PVA Resin has high molecular weight and improved physical properties, PVA Resin offers enhanced tensile strength, flexibility, and solubility. It is widely utilized in the production of various fiber types, such as synthetic fibers, due to its excellent affinity for dyes and ability to improve fiber strength. Moreover, PVA Resin serves as a crucial ingredient in the formulation of latex paints, where it provides improved adhesion and water resistance properties.

 

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ElephChem Holding Limited, professional market expert in Polyvinyl Alcohol(PVA) and Vinyl Acetate–ethylene Copolymer Emulsion(VAE) with strong recognition and excellent plant facilities of international standards.

 

The Versatility of Modified PVA

Modified PVA is a variation of Polyvinyl alcohol that undergoes chemical or physical modifications to enhance or introduce new properties. These modifications can include cross-linking, grafting, blending, or copolymerization with other materials. The resulting Modified PVA exhibits improved characteristics, making it suitable for a wide range of applications.

 

Modified polyvinyl alcohol also known as PVOH. There are two main grades of modified polyvinyl alcohol. one is used for PVC called PVOH PVC grade, and the other is PVOH Water-soluble films grade. Its versatility, biodegradability, and ease of modification set it apart from other materials. As global industries increasingly prioritize sustainability and high-performance solutions, Modified PVA is poised to play a significant role in shaping the future of various sectors.Whether it's in adhesives, coatings, textiles, or pharmaceuticals, Modified PVA offers exceptional properties that meet diverse application needs. As the market continues to evolve, exploring innovative uses and combinations of Modified PVA will unlock untapped potential for this remarkable polymer.

 

The packaging industry, in particular, holds immense potential for Modified PVA, as it offers enhanced barrier properties, extended shelf life, and reduced environmental impact compared to traditional alternatives. Moreover, the growing demand for specialty coatings, adhesives, and films in the automotive sector further boosts the market prospects for Modified PVA.

 

Choose ELEPHCHEM for Your Modified PVA Needs: ELEPHCHEM, a leading supplier of Modified PVA, offers a wide range of high-quality products and customized solutions. With their expertise and commitment to customer satisfaction, ELEPHCHEM is your trusted partner in optimizing the performance of Modified PVA for your specific applications. Contact ELEPHCHEM today to explore the endless possibilities of Modified PVA.

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VAE Emulsion Production Process

VAE emulsion is the abbreviation of vinyl acetate-ethylene copolymer emulsion. It is a polymer emulsion formed by emulsion polymerization of vinyl acetate and ethylene monomer as basic raw materials with other auxiliary materials.‌The production process of VAE emulsion mainly includes the following steps‌:

The main raw materials of VAE emulsion include ethylene, vinyl acetate, emulsifier and initiator. Ethylene can be made from naphtha or natural gas; vinyl acetate is made from the reaction of ethylene and acetic acid.

 

After mixing ethylene and vinyl acetate in a certain proportion, they are passed into the reactor, initiators and emulsifiers are added, and emulsion polymerization is carried out under appropriate temperature and pressure. Control the reaction speed and temperature to completely convert the monomer and generate VAE emulsion‌.

 

The generated VAE emulsion needs to be degassed to remove unreacted monomers and low molecular volatiles. Adjust the pH value of the emulsion to make it more stable, and perform filtration to remove impurities and solid particles in the emulsion.

 

Put the processed VAE emulsion into a special container, seal it and store it away from direct sunlight and high temperature environment.

 

The production and use of VAE emulsion must comply with national and local environmental protection standards, including emission standards for waste water, exhaust gas, noise, etc. Waste water, waste gas and other waste generated during the production process need to be effectively treated and discharged to ensure compliance with environmental protection requirements.

 

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Versatile High Quality Applications-VAE Emulsion

VAE emulsion, short for Vinyl Acetate Ethylene copolymer emulsion, is a versatile material widely used in various industries. Its unique properties make it an essential ingredient in the manufacturing of adhesives, paints, coatings, and construction materials.

 

VAE Emulsion is a water-based dispersion composed of vinyl acetate and ethylene monomers. This copolymerization results in a high-quality emulsion that offers outstanding adhesive properties, excellent flexibility, and exceptional bonding strength. VAE Emulsion acts as a binder, providing exceptional stability and enhancing the performance of various end products.

 

One of the notable applications of VAE Emulsion is in the production of adhesives. Due to its excellent adhesion properties, VAE Emulsion is widely used in industries such as woodworking, paperboard lamination, and packaging. The high bonding strength and flexibility of VAE Emulsion enable it to deliver durable and long-lasting adhesion, ensuring the integrity of bonded surfaces.

 

In the world of architectural coatings, VAE Emulsion plays a crucial role as a binder. It is known for its exceptional film-forming abilities, providing coatings with excellent weather resistance, water repellency, and durability. Moreover, VAE Emulsion enhances the color stability and gloss of coatings, resulting in a visually appealing finish. Its versatility allows it to be used in various coating systems, including exterior paints, interior wall paints, and textured coatings.

 

Construction materials also benefit from the extraordinary properties of VAE Emulsion. It can be combined with cement, gypsum, or other powders to produce VAE Redispersible Powder. When used in tile adhesives, grouts, and self-leveling compounds, VAE Redispersible Powder enhances workability, water retention, and adhesion strength. This combination ensures reliable performance in demanding applications, such as tile installation and repair.

 

While the quality of the product itself is essential, exceptional service adds significant value to the overall customer experience. ELEPHCHEM, a leading supplier of VAE Emulsion and related products, is known for its commitment to providing comprehensive services. From technical support to customized solutions, ELEPHCHEM assists clients in optimizing their applications and achieving the desired results. Their expertise and industry knowledge have made them a trusted partner for many businesses.

 

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Vinyl Acetate-Ethylene Emulsion

VAE emulsion is short for ethylene acetate-ethylene copolymerization emulsion, which is a polymer emulsion made of ethylene acetate and ethylene monomer as the basic raw materials and other auxiliary materials through emulsion.

Products with ethylene acetate content in the range of 70%~95% are usually in the emulsion state, called VAE emulsions.

 

 

VAE Emulsion is a copolymer of vinyl acetate with low ethylene content having been developed as a powerful adhesive base. It has excellent performance in environmental protection, has good adhesion and environmental protection properties, and is widely used in green fine chemical products. Due to its excellent comprehensive performance and environmental protection characteristics, VAE emulsion is very popular in the market and has become an indispensable green fine chemical product. ‌VAE emulsion is widely used in building materials, textiles, printing and dyeing, papermaking, adhesives, etc.

Recommended: ★ ;   Useful: ●

 

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Dicyandiamide cured epoxy adhesives

I. Introduction

One of the most important parameters and starting points for the development of epoxy resin formulations is the epoxy resin curing mechanism and the selection of the specific curing agent to be used. Dicyandiamide is one of the most widely used catalysts for curing one-component epoxy adhesives. This type of adhesive has a long shelf life at room temperature, but offers relatively fast curing at temperatures above 150°C. Dicyandiamide cured epoxy adhesives have a wide range of uses, especially in the transportation, general assembly and electrical/electronic markets.

 

II. Dicyandiamide

Dicyandiamide (also known as “dicy”) is a solid latent curing agent that reacts with both the epoxy group and the secondary hydroxyl group. This curing agent is a white crystalline powder that is easily incorporated into epoxy formulations. Figure 1 is a graphical representation of the dicyandiamide molecule.

 

 

This curing agent cures through nitrogen-containing functional groups and consumes the epoxy and hydroxyl groups in the resin. The advantage of dicyandiamide is that it reacts with the epoxy resin only when heated to the activation temperature, and the reaction stops once the heat is removed. It is widely used in epoxy resins and has a long shelf life (up to 12 months). Longer shelf life can be obtained by refrigerated storage.

Due to its delayed cure (long shelf life) and excellent properties, dicyandiamide is used in many “Class B” film adhesives. Dicyandiamide is also one of the main catalysts for one-component, high-temperature curing epoxy adhesives.

In adhesive formulations, dicyandiamide is used in quantities of 5-7 pph for liquid epoxy resins and 3-4 pph for solid epoxy resins. it is generally dispersed with epoxy resins by ball milling. Dicyandiamide forms very stable mixtures with epoxy resins at room temperature because it is insoluble at low temperatures. The particle size and distribution of the epoxy-dicyandiamide system is critical for extending its shelf life. In general, the best performance is produced when the particle size of the dicyandiamide is less than 10 microns. Fumed silica is commonly used to keep the dicyandiamide particles suspended and evenly distributed in the epoxy resin. When formulated as a one-component adhesive system, epoxy dicyandiamide is stable when stored at room temperature for six months to one year. It is then cured by exposure to 145-160°C for approximately 30-60 minutes. Because of the relatively slow reaction rate at lower temperatures, the addition of 0.2% ~ 1.0% phenyl dimethylamine (BDMA) or other tertiary amine accelerators is sometimes used to reduce the cure time or lower the cure temperature. Other common accelerators are imidazole, substituted urea and modified aromatic amines. Substituted dicyandiamide derivatives can also be used as epoxy curing agents with higher solubility and lower activation temperatures. These techniques can reduce the activation temperature of epoxy-dicyandiamide mixtures to 125°C. Dicyandiamide-cured epoxy resins have good physical properties, heat and chemical resistance. Liquid epoxy cured with 6 pph dicyandiamide has a glass transition temperature of about 120°C, while high temperature curing with aliphatic amines will provide a glass transition temperature of no greater than 85°C.

 

III. One-component adhesive formulations

In one-component epoxy adhesives, the curing agent and resin are compounded together as a single material through an adhesive formulation. The curing agent system is selected so that it reacts with the resin only under appropriate processing conditions. Dicyandiamide-cured epoxy resins are very brittle. Through the use of toughening agents, such as terminated carboxybutyronitrile (CTBN), it is possible to formulate very elastic and tough adhesives without sacrificing the good properties inherent in unmodified systems. With toughened dicyandiamide-cured epoxies, peel strengths are approximately 30 lb/in and tensile shear strengths are in the range of 3000-4500 psi. Toughened dicyandiamide-cured epoxy adhesives also exhibit good resistance to heat cycling. The most effective accelerators for dicyandiamide systems are probably substituted ureas because of their synergistic effect on the performance of the adhesive and their exceptionally good latent delay. It has been shown that the addition of 10 pph of substituted urea to 10 pph of dicyandiamide will produce a bisphenol- a (DGEBA) epoxy liquid diglycidyl ester binder system that cures in only 90 min at 110 °C. However, this adhesive has a shelf life of three to six weeks at room temperature. If longer curing times are acceptable, curing can even be achieved at temperatures as low as 85°C.

 

Epoxy resin knowledge| Dielectric properties of epoxy resins

A dielectric is any insulating medium between two conductors. Simply put, it is non-conductive material. Dielectric materials are used to make capacitors, to provide an insulating barrier between two conductors (e.g., in crossover and multilayer circuits), and to encapsulate circuits.

 

Dielectric Properties

Epoxy resin usually has the following four dielectric properties:VR, Dk, Df and dielectric strength.

  • Volume resistivity (VR): It is defined as the resistance measured through the material when a voltage is applied for a specific period of time. According to ASTM D257, for insulation products, it is usually greater than or equal to 0.1 tera ohm-meter at 25°C and greater than or equal to 1.0 mega ohm-meter at 125°C.
  • Dielectric constant (Dk): it is defined as the ability of the material to store charge when used as a capacitor dielectric. According to ASTM D150, it is usually less than or equal to 6.0 at 1KHz and 1MHz, and is a dimensionless value because it is measured as a ratio.
  • The dissipation factor (Df) (also known as the loss factor or dielectric loss): defined as the power dissipated by the medium, usually less than or equal to 0.03 at 1KHz, less than or equal to 0.05 at 1MHz.
  • Dielectric strength (sometimes called breakdown voltage): is the maximum electric field that the material can withstand before breakdown. This is an important characteristic for many applications that require running high currents or amperages. As a general rule of thumb, the dielectric strength of epoxy resins is about 500 volts per mil at 23°C for insulating products. As a practical example, if an electronic circuit needs to resist 1000 volts, a minimum of 2 mils of dielectric epoxy is required.

Volume resistivity, dielectric constant, and dissipation factor can be determined experimentally by the adhesive manufacturer; however, dielectric strength depends on the application. Users of epoxy resins should always verify the dielectric strength of the adhesive for their particular application.

 

Variability of dielectric properties

Many dielectric properties will vary with factors unrelated to the properties of the host material, such as: temperature, frequency, sample size, sample thickness and time. Some external factors and how they affect the final results.

  • VR and Temperature

As the temperature of the material increases, the VR decreases. In other words, it is no longer an insulator. The main reason for this is that the material is above its glass transition temperature (Tg) and the molecular motion of the monomers entangled in the polymer network is at its highest level. This not only means lower insulation compared to room temperature, but also leads to lower strength and sealing.

  •  Dk and temperature

The dielectric constant of room temperature cured epoxy resins increases with temperature. For example, the value is 3.49 at 25°C, becomes 4.55 at 100°C, and 5.8 at 150°C. In general, the higher the value of Dk, the less electrically insulating the material is.

  • Dk and frequency (Rf) 

In general, Dk decreases with increasing frequency. As described in the effect of temperature on Dk, room temperature cured epoxy resin has a Dk value of 3.49 at 60Hz, a Dk value of 3.25 at 1KHz and a Dk value of 3.33 at 1MHz.

In other words, as Rf increases, the insulating properties of the adhesive increase. Therefore, the lower the Dk value, the more the material acts like an insulator.

 

 Common Applications

Dielectric adhesives are used in most semiconductor and electronic packaging applications. Some examples include: semiconductor flip chip underfill, SMD placement on PCBs and substrates, wafer passivation, spherical tops for ICs, copper ring dipping and general PCB potting and encapsulation. All of these areas require maximum insulation to eliminate and prevent any electrical shorts.

 

 Insulation Products

Epoxy Technologies offers a wide range of products for dielectric applications that have structural, optical and thermal properties as well as good dielectric properties. All dielectric products are electrical insulators, but many are also heat conductors.